Method of manufacturing an endodontic instrument
US7207111B2 · kind B2 · utility
21Cited by
22References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2004 |
| Grant date | Apr 24, 2007 |
| Priority date | — |
| Expiry date | Jun 17, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49568
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Method for manufacturing endodontic instruments having either helical or non-helical flutes with hard surfaces and resilient cutting edges by either an EDM or ECM process, wherein material is removed from the instrument blank in the desired flute pattern. The EDM or ECM process disintegrates the surface material, and as it cools, at least a portion of the removed material re-deposits onto the surface being machined to form a recast layer having a surface hardness that is at least about 15% greater than the hardness of the material forming the instrument blank.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.