Vacuum gripper for handling small components
US7207430B2 · kind B2 · utility
6Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2004 |
| Grant date | Apr 24, 2007 |
| Priority date | — |
| Expiry date | Sep 15, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is a method and apparatus for use within a die feeder associated with a circuit board assembly machines and includes, among other aspects and features, a cavity to capture and maintain the position of the die within a vacuum gripper. The invention also includes the interaction of a pair of nozzles whereas one moves within the nozzle tip containing the die cavity and has the ability to compensate for any offset between the nozzles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.