Sealing material tablet method of manufacturing the tablet and electronic component device
US7208113B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2002 |
| Grant date | Apr 24, 2007 |
| Priority date | — |
| Expiry date | Oct 24, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2998
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
To provide a method of producing an encapsulating molding material tablet by which adhesion of an encapsulating molding material to the punch surface of a tablet forming machine can be reduced, an encapsulating molding material tablet produced by this method, and an electronic part apparatus equipped with an element encapsulated using this encapsulating molding material tablet. A method of producing an encapsulating molding material tablet in which a release agent dissolved in a solvent is fed to the punch surface of a tablet forming machine to form a release agent layer having a thickness of over 0.001 μm and less than 0.07 μm on the above-mentioned punch surface, then, an encapsulating molding material is fed to the above-mentioned tablet forming machine for molding the material, an encapsulating molding material tablet produced by this method or having a contact angle ratio of 1.15 or more and less than 1.35, and an electron part apparatus equipped with an element encapsulated using this encapsulating molding material tablet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.