Thermally or electrically-conductive form-in-place gap filter
US7208192B2 · kind B2 · utility
25Cited by
48References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2003 |
| Grant date | Apr 24, 2007 |
| Priority date | — |
| Expiry date | Oct 10, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Application of a thermally and/or electrically conductive compound to fill a thermal and/or EMI shielding gap between a first and a second surface. A supply of a fluent, form-stable compound is provided as an admixture of a cured polymer gel component, and a particulate filler component. An of the compound is dispensed from a nozzle or other orifice under an applied pressure onto one of the surfaces which, when opposed, form the gap, or into the gap formed between the surfaces. The gap is at least partially filled by at least a portion of the dispensed compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.