Patent · US Expired

Method of forming light emitting devices including forming mesas and singulating

US7208337B2 · kind B2 · utility

178Cited by

4References

40Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Dominik Eisert · Regensberg, DE
Stefan Illek · Donaustauf, DE
Wolfgang Schmid · Regensburg, DE

Key dates

Filing date	Sep 5, 2003
Grant date	Apr 24, 2007
Priority date	—
Expiry date	Sep 5, 2023

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/351
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor component having a light-emitting semiconductor layer or a light-emitting semiconductor element, two contact locations and a vertically or horizontally patterned carrier substrate, and a method for producing a semiconductor component are disclosed for the purpose of reducing or compensating for the thermal stresses in the component. The thermal stresses arise as a result of temperature changes during processing and during operation and on account of the different expansion coefficients of the semiconductor and carrier substrate. The carrier substrate is patterned in such a way that the thermal stresses are reduced or compensated for sufficiently to ensure that the component does not fail.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.