Semiconductor device and method of manufacturing the same
US7208360B2 · kind B2 · utility
1Cited by
10References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 22, 2006 |
| Grant date | Apr 24, 2007 |
| Priority date | — |
| Expiry date | Mar 22, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/28211
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is proposed which includes: a semiconductor substrate of a first conductivity type; a channel region formed at a surface of the semiconductor substrate;
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.