Hot melt adhesive
US7208541B2 · kind B2 · utility
3Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2003 |
| Grant date | Apr 24, 2007 |
| Priority date | — |
| Expiry date | Jan 7, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A hot melt adhesive based on ethylene-2-ethylhexyl acrylate copolymer finds use in packaging applications where high heat resistance, as well as good cold tolerance, is required.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.