LED arrangement
US7208769B2 · kind B2 · utility
25Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2005 |
| Grant date | Apr 24, 2007 |
| Priority date | — |
| Expiry date | Apr 29, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention concerns an LED arrangement with at least one LED chip (11) comprising a radiation decoupling surface (12) through which the bulk of the electromagnetic radiation generated in the LED chip (11) is decoupled. Arranged on the radiation decoupling surface (12) is at least one phosphor layer (13) for converting the electromagnetic radiation generated in the LED chip. A housing (17) envelops portions of the LED chip (11) and the phosphor layer (13).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.