Patent · US Expired

Method of forming a raised source/drain and a semiconductor device employing the same

US7208803B2 · kind B2 · utility

11Cited by
14References
10Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMay 5, 2004
Grant dateApr 24, 2007
Priority date
Expiry dateDec 13, 2024

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S257/90

Abstract

A method of forming a raised source/drain proximate a spacer of a gate of a transistor on a substrate, and a semiconductor device of an integrated circuit employing the same. In one embodiment, the method includes orienting the gate substantially along a <100> direction of the substrate. The method also includes providing a semiconductor material adjacent the spacer of the gate to form a raised source/drain layer of the raised source/drain oriented substantially along a <100> direction of the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.