Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate
US7208833B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2005 |
| Grant date | Apr 24, 2007 |
| Priority date | — |
| Expiry date | Mar 3, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic circuit device comprises: a semiconductor element having a first surface and a second surface, with the first and second surfaces being on first and second sides of the semiconductor element, respectively, and facing in opposite directions; a first electrode on the first surface; a second electrode on the second surface; a first circuit board electrically connected to the first electrode via a metallic plate such that the metallic plate and the semiconductor element are on the first circuit board; a second circuit board on the second side of the semiconductor element, the second circuit board having a control circuit for the semiconductor element; and a metallic wire for directly electrically interconnecting the second electrode and the second circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.