Semiconductor device, circuit board, and electronic instrument suitable for stacking and having a through hole
US7208838B2 · kind B2 · utility
29Cited by
2References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 15, 2004 |
| Grant date | Apr 24, 2007 |
| Priority date | — |
| Expiry date | Mar 15, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07811
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor device body section having a substrate and an electrode formed on the substrate. A through-hole is formed through the electrode and the substrate in a stacking direction of the electrode and the substrate, and a conductive member is inserted into the through-hole. An insulating material which faces at least the through-hole is formed on the electrode. The conductive member is formed over the insulating material from the through-hole and is connected with the electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.