Modular sensing apparatus
US7210346B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2005 |
| Grant date | May 1, 2007 |
| Priority date | — |
| Expiry date | Jan 5, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/025
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A modular sensing apparatus includes a sensing diaphragm that accommodates a particular pressure range. A pressure port can be connected to the sensing diaphragm to provide pressure data thereof. Additionally, the modular sensing apparatus includes a connector and a temperature sensor pre-selected by a user, such that the connector is attached to a pressure port. An integrated circuit can be configured to provide a desired output for respective pressure and temperature from the sensing diaphragm and the temperatures sensor and to provide error corrections thereof. The sensing diaphragm, the temperature sensor, the integrated circuit and the connector are electrically connected utilizing flexible circuitry to form the modular sensing apparatus assembled to at least one requirement of the user in order to provide simultaneous and application independent pressure and temperature sensing data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.