Optoelectronic components with multi-layer feedthrough structure
US7210859B2 · kind B2 · utility
13Cited by
15References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2004 |
| Grant date | May 1, 2007 |
| Priority date | — |
| Expiry date | Nov 2, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/183
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
This disclosure concerns a platform suitable for use in connection with optoelectronic components and devices. In one example, the platform includes multiple stacked platform layers. A conductive pathway of the platform is supported by at least one of the stacked platform layers, and the conductive pathway is configured and arranged so as to be at least partly coextensive with the platform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.