Multi-polar feedthrough array for analog communication with implantable medical device circuitry
US7210966B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2004 |
| Grant date | May 1, 2007 |
| Priority date | — |
| Expiry date | Apr 13, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/12
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An improved multi-polar feedthrough assembly employs a particular metallic ferrule material for improved dimensional stability during initial fabrication and sustained hermetic operation. In one aspect, the disclosure relates to implantable medical devices (IMDs) including an IMD enclosure fabricated with grade 2 titanium and having a ferrule material fabricated with grade 4 titanium or grade 5 titanium. In one form, the multi-polar feedthrough assembly includes a filtered feedthrough array (e.g., employing capacitive filters coupled to the electrically conductive pins or serpentine conductors of the array). According to another aspect, the improved multi-polar feedthrough assembly incorporates additional pins, thus increasing the footprint of the assembly, and the additional pins provide analog electrical communication between operative circuitry inside an IMD and analog components external to the IMD.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.