Biocompatible bonding method and electronics package suitable for implantation
US7211103B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2002 |
| Grant date | May 1, 2007 |
| Priority date | — |
| Expiry date | May 13, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by one of several methods, including attachment by an electrically conductive adhesive, such as epoxy or polyimide, containing platinum metal flake in biocompatible glue; diffusion bonding of platinum bumps covered by an insulating layer; thermal welding of wire staples; or an integrated interconnect fabrication. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.