High conductivity inks with improved adhesion
US7211205B2 · kind B2 · utility
17Cited by
29References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2003 |
| Grant date | May 1, 2007 |
| Priority date | — |
| Expiry date | Jan 29, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/095
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the compositions to various substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.