Patent · US Expired

Method for encapsulating a plurality of electronic components

US7211468B2 · kind B2 · utility

1Cited by

4References

16Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Bernhard Auburger · Burglengenfeld, DE
Klaus Bauer · Neuendettelsau, DE
Ronald Henzinger · Regensburg, DE
Wighard Jäger · Spardorf, DE
Hermann Leiderer · Geisingen, DE
Armin Rubey · Regensburg, DE

Key dates

Filing date	Jan 26, 2004
Grant date	May 1, 2007
Priority date	—
Expiry date	Apr 10, 2024

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19041
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for encapsulating the electronic component and a method for producing electronic components according to the method include coating the component with a coating material. The coating material is hardened and an assembly including the component and the coating is encapsulated in plastic. In particular, the coating can be accomplished by immersion. The electronic component includes the coating encapsulation of a coating material applied in a flowable condition and hardened and a plastic encapsulation encapsulating the coating.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.