Resin-impregnated substrate
US7211527B2 · kind B2 · utility
2Cited by
1References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2005 |
| Grant date | May 1, 2007 |
| Priority date | — |
| Expiry date | Sep 5, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/696
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A resin-impregnated substrate is obtained by a method comprising the steps of immersing a sheet comprising an aromatic liquid crystalline polyester fiber in an aromatic liquid crystalline polyester solution containing 100 parts by weight of a solvent and 0.5 to 100 parts by weight of an aromatic liquid crystalline polyester and removing the solvent, the solvent containing on a weight basis with respect to the solvent 30% or more of a phenol compound. The resin-impregnated substrate has a high heat resistance in soldering conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.