Resin-impregnated substrate
US7211528B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2005 |
| Grant date | May 1, 2007 |
| Priority date | — |
| Expiry date | Sep 6, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2861
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin-impregnated substrate having a high heat resistance at a high temperature under soldering conditions and a small linear expansion rate is provided. The resin-impregnated substrate can be obtained by a method comprising the steps of immersing a sheet comprising an aromatic liquid-crystalline polyester fiber in an aromatic liquid-crystalline polyester solution containing an aprotonic solvent and a liquid-crystalline polyester comprising 10 to 35% by mol, with respect to the total repeating units of the polyester, of at least one repeating unit selected from the group consisting of a repeating unit derived from an aromatic diamine and a repeating unit derived from an aromatic amine with a phenolic hydroxyl group; and removing the solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.