Connection pad layouts
US7211736B2 · kind B2 · utility
2Cited by
20References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2003 |
| Grant date | May 1, 2007 |
| Priority date | — |
| Expiry date | Jan 25, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In an implementation of connection pad layouts, a connection assembly includes a substrate assembly and connection pads disposed thereon. The connection pads form a configuration such that each connection pad is configured to align with a different terminal of an interconnect that is warped or otherwise has a non-linear alignment of terminals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.