Bonding pad structure for a display device and fabrication method thereof
US7211738B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2004 |
| Grant date | May 1, 2007 |
| Priority date | — |
| Expiry date | Apr 20, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09509
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A bonding pad structure of a display device. A first conductive layer is formed overlying a substrate, a protection layer is formed overlying the substrate and the first conductive layer, and a second conductive layer is formed overlying the protection layer. An opening structure penetrates the second conductive layer and the protection layer to expose the first conductive layer. A third conductive layer is formed overlying the second conductive layer to contact the sidewall and bottom of the opening structure. Thus, the third conductive layer is electrically connected to the second conductive layer to provide a first electrical-connection path, and the third conductive layer is electrically connected to the first conductive layer to provide a second electrical-connection path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.