Apparatus and method for cooling electronics and computer components with managed and prioritized directional air flow heat rejection
US7212403B2 · kind B2 · utility
163Cited by
23References
73Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 25, 2004 |
| Grant date | May 1, 2007 |
| Priority date | — |
| Expiry date | Jul 20, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An apparatus and method of cooling a plurality of electronic components in a housing using one or more fans cooperating with baffles or ducts for directing a stream of air sequentially to the components or heat exchangers for the components. Direction of the air stream to the components is based on predetermined cooling prioritization of the plurality of components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.