Laser ribbon bond pad array connector
US7214068B2 · kind B2 · utility
9Cited by
4References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2004 |
| Grant date | May 8, 2007 |
| Priority date | — |
| Expiry date | Apr 6, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/909
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A laser ribbon bond pad array connector is disclosed for electrically connecting a RF module to an IMD circuit board in an implantable medical device. The array connector includes a connector body with a plurality of electrically isolated bonding fingers embedded in the connector body. Each bonding finger includes a solder pad that is on a first surface of the connector body and a laser ribbon bond pad that is on a second surface of the connector body. The first and second surfaces are spaced apart in angular relations thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.