Laser depilating method and laser depilating apparatus
US7214222B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2002 |
| Grant date | May 8, 2007 |
| Priority date | — |
| Expiry date | Jan 29, 2022 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2018/208
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A laser depilating method for depilating treatment by irradiating a skin surface with a laser beam emitted from a semiconductor laser. A treatment region of the skin surface is treated with a semiconductor laser beam for an irradiation time of 100 msec or more per irradiation while controlling the laser beam so that the energy density when irradiating the skin surface may be in a range of 0.01–1 J/mm2. Irradiation of the skin surface with a semiconductor laser beam under such a condition provides a more secure and efficient treatment effect of laser depilation. A plurality of semiconductor laser beams are used as necessary to irradiate a wider area of skin surface at a time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.