Method of fabricating a wire bond with multiple stitch bonds
US7214606B2 · kind B2 · utility
6Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2004 |
| Grant date | May 8, 2007 |
| Priority date | — |
| Expiry date | Jul 21, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a wire bond bonding a wire to a connection pad of an electronic device, and a method of forming the wire bond. A first stitch bond is formed on the connection pad, and a second stitch bond is next formed on the connection pad that is contiguous with the first stitch bond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.