Compliant wirebond pedestal
US7214607B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2005 |
| Grant date | May 8, 2007 |
| Priority date | — |
| Expiry date | Apr 1, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.