Resist pattern forming method, magnetic recording medium manufacturing method and magnetic head manufacturing method
US7214624B2 · kind B2 · utility
16Cited by
4References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 8, 2004 |
| Grant date | May 8, 2007 |
| Priority date | — |
| Expiry date | Jun 8, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B2005/3996
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mold having a pattern of a concavo-convex surface including protrusion and recess is prepared and the pattern is transferred to a resist layer formed on a substrate by an imprinting method. The side surface of a protrusion of the transferred resist pattern is then etched so that the protrusion has a width narrower than a width of the corresponding recess formed to the mold. This resist pattern forming method is preferably applicable to a magnetic recording medium manufacturing method and a magnetic head manufacturing method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.