Semiconductor device and semiconductor apparatus
US7215013B2 · kind B2 · utility
2Cited by
2References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 29, 2004 |
| Grant date | May 8, 2007 |
| Priority date | — |
| Expiry date | Apr 29, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprises a bonding surface to be mounted with adhesive or solder on a mounting surface of a mounting member. One or more grooves are provided on the bonding surface that extend in a direction substantially parallel to one side surface of the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.