Contactless circuit testing for adaptive wafer processing
US7215133B2 · kind B2 · utility
10Cited by
12References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 30, 2004 |
| Grant date | May 8, 2007 |
| Priority date | — |
| Expiry date | Mar 21, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/311
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method for measuring circuits on an integrated circuit substrate includes a measurement circuit formed on the integrated circuit substrate that measures at least one characteristic of an integrated circuit. The measurement circuit has a power transfer device including a power transfer component, which receives energy from a source where the source does not make physical contact with the integrated circuit substrate to transfer power to the measurement circuit. Measurements are taken to provide feedback for in-situ adjustments to circuit parameters and responses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.