Chip that comprises an active agent and an integrated heating element
US7215878B2 · kind B2 · utility
8Cited by
10References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2001 |
| Grant date | May 8, 2007 |
| Priority date | — |
| Expiry date | Jan 3, 2021 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61L9/03
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Active compound chip and process for the production of an active compound chip comprising an active compound which is bound at room temperature, at least one heating element being located at least partly in the interior of the chip and the heating element having an electrical resistance and at least two electrical contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.