Method of forming a capacitor assembly in a circuit board
US7216422B2 · kind B2 · utility
6Cited by
14References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2004 |
| Grant date | May 15, 2007 |
| Priority date | — |
| Expiry date | Dec 8, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board includes an assembly having first and second power reference plane layers, and an insulator layer between the first and second power reference plane layers. Discrete decoupling capacitors are further provided with the assembly. Additional layers are provided above and below the assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.