Patent · US Expired

Brush filament bundles and preparation thereof

US7217332B2 · kind B2 · utility

21Cited by
15References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 10, 2002
Grant dateMay 15, 2007
Priority date
Expiry dateMay 25, 2024

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/2913
  • WIPO fieldTextile and paper machines
  • WIPO sectorMechanical engineering

Abstract

Methods and devices are provided for forming filament bundles of long, continuous strands of filaments. The methods include bonding the long, continuous stands of filaments together so that they cannot move axially with respect to any other filament in the bundle. Methods of bonding include ultrasonic welding, freezing or applying adhesive.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.