Reactive ion milling/RIE assisted CMP
US7217666B2 · kind B2 · utility
1Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2004 |
| Grant date | May 15, 2007 |
| Priority date | — |
| Expiry date | Sep 30, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49048
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming a high aspect ratio magnetic structure in a magnetic write head using a combination of chemical mechanical polishing and reactive ion etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.