System and method for reducing crosstalk between vias in a printed circuit board
US7217889B1 · kind B1 · utility
23Cited by
4References
44Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2003 |
| Grant date | May 15, 2007 |
| Priority date | — |
| Expiry date | Nov 24, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Two pairs of vias are arranged in a printed circuit board. A first pair of vias, which conveys a first signal pair, is arranged in a plane that is substantially equidistant from the vias in a second pair of vias, which conveys a second signal pair. Similarly, the second pair of vias is located in a plane that is substantially equidistant from each via in the first pair of vias. In some embodiments, such an arrangement reduces the crosstalk effect of the first signal pair on the second signal pair and vice versa.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.