Ball grid array socket having improved housing
US7217996B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2005 |
| Grant date | May 15, 2007 |
| Priority date | — |
| Expiry date | Mar 10, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1069
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A ball grid array (BGA) socket includes an insulative housing (11), a number of terminals (12) and a protecting device (114). The insulative housing includes a mating surface (111), a mounting surface (112) opposite to mating surface, a plurality of passageways (113) extending between the mating surface and the mounting surface and a plurality of electrical terminals (12) received in the passageways. Each of the terminals includes a body portion (121); a contacting portion (122) extending forwardly from the body portion and a soldering portion (123) extending downwardly from the body portion and extending beyond the mounting surface of the insulative housing. The protecting device is arranged on the mounting surface. In a perpendicular direction, a distance between a bottom surface of the protecting device and the mounting surface is longer or equal to another distance between soldering portion and the mounting surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.