Ground arch for wirebond ball grid arrays
US7217997B2 · kind B2 · utility
31Cited by
12References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 30, 2004 |
| Grant date | May 15, 2007 |
| Priority date | — |
| Expiry date | Jul 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure provides for the control of bond wire impedance. In an example embodiment, there is an integrated circuit device comprising a semiconductor device die having a plurality of grounding pads, signal pads, and power pads and a package for mounting the integrated circuit and includes a conductive path having at least one reference trace that surrounds the integrated circuit. A grounding arch is disposed over the semiconductor device die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.