Multi-port high-speed serial fabric interconnect chip in a meshed configuration
US7218640B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2002 |
| Grant date | May 15, 2007 |
| Priority date | — |
| Expiry date | Jul 29, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L47/34
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
Multiple boards are connected within a chassis, using a multi-port Target Channel Adapter (TCA). Data is transported from a TCA on a board directly to a TCA on another board through a meshed backplane. The meshed backplane is equipped to mount boards via connectors and may consist of a fabric of copper conductors or optical fibers. Communication from TCA to TCA requires placing ports on each individual TCA along with the appropriate input and output buffering. A multi-port TCA capable of performing multiple bridging functions simultaneously i.e., bridging from a high speed serial meshed backplane to multiple local busses, i.e., Gigabit Ethernet, Fibre Channel, and TCP/IP devices, is referred to as a Fabric Interconnect Chip (FIC).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.