Electromechanical device having a plurality of bundles of fibers for interconnecting two planar surfaces
US7220131B1 · kind B1 · utility
8Cited by
10References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2006 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | Sep 12, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to various embodiments, exemplary interconnects and methods for interconnection are provided that can include contacts formed by fiber bundles. The exemplary interconnects can be used to form separable or non-separable electro-mechanical connections between one or more of the generally accepted six levels of interconnection. In various embodiments, the exemplary interconnects can allow management of the thermal properties of the electronic devices. Exemplary interconnects can also provided reduced thickness allowing redundancy and additional compliance as desired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.