Low profile LGA socket assembly
US7220134B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2005 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | Feb 24, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1061
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A socket terminal assembly is configured to electrically connect a contacting area of an integrated circuit with a corresponding connection region of a substrate, the socket terminal assembly comprising a socket shell including a first end configured to contact the corresponding connection region of the substrate and a second end defining a first open cavity; a pin including an end defining a second open cavity; and a coiled spring interposed between the socket shell and the pin, the spring including a first end section received within the first open cavity and a second end section received within the second open cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.