Devices using a medium having a high heat transfer rate
US7220365B2 · kind B2 · utility
102Cited by
10References
276Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2001 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | Dec 1, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1317
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Disclosed is a heat transfer medium having high heat transfer rate, being useful in even wider fields, simple in structure, easy to made, environmentally sound, and capable of rapidly conducting heat and preserving heat in a highly efficient manner. Further disclosed are a heat transfer surface and a heat transfer element utilizing the heat transfer medium. Further disclosed are applications of the heat transfer element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.