Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto
US7220490B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2004 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | Aug 10, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The low modulus polyimide adhesive compositions of the present invention contain a low modulus polyimidosiloxane polymer, a thermosetting substantially-non-halogenated epoxy (optionally including an epoxy catalyst), a plasticizer, an insoluble halogen-free flame-retardant filler, and optionally an adhesion promoter. The adhesive can be applied upon (or incorporated into) flexible circuits using a relatively low lamination temperature, generally no higher than 200, 190, 180, 175, 170, 165, 160, 155, or 150° C. The adhesive is generally resistant to unwanted curl even in cases where the adhesive polyimide and the base film polyimide have a coefficient of linear thermal expansions (measured between 50° C. and 250° C.) that differ by more than 10, 15, 20 25, or 30 ppm/° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.