Lead-free solder, and a lead-free joint
US7220493B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 23, 2003 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | Oct 23, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12792
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liquid phase temperature of 260 degrees C. or greater, and contains 30 to 70 weight percent zinc, 5 weight percent or less nickel, and the remaining weight percent tin. Moreover, a joint is manufactured using these lead-free solders. As a result, a lead-free solder and a lead-free joint having excellent electrical characteristics but not including harmful substances, can be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.