Semiconductor wafer and semiconductor device provided with columnar electrodes and methods of producing the wafer and device
US7220657B2 · kind B2 · utility
49Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2002 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | May 21, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer provided with columnar electrodes which have plated nickel, palladium, and gold films successively formed at the top thereof, or have a plated solder film at their top. The semiconductor wafer can be preferably used for producing a chip-sized semiconductor device provided with columnar electrodes to which an external connection terminal, such as a solder ball, is to be bonded. Methods of producing the semiconductor wafer and device by use of plating are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.