Flat chip semiconductor device and manufacturing method thereof
US7221045B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2005 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | May 20, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip chip semiconductor device having an improved structure and a method of manufacturing the flip chip semiconductor device, in which a semiconductor chip can be more securely joined to a lead frame while preventing contact defects between the two. The flip chip semiconductor device includes: a semiconductor chip having electrode pads formed on one side; conductive bumps formed on the electrode pads of the semiconductor chip; and a lead frame including a plurality of leads, the ends of which are electrically connected to the conductive bumps, wherein each of the leads has at least one groove formed thereon, and a solder plating layer is provided on the leads in and about the groove and melted to secure the connection with the conductive bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.