Magnetic sensor apparatus and manufacturing method thereof
US7221157B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2005 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | Sep 24, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N52/01
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Two Hall element forming arrangements are formed on a semiconductor substrate. Each Hall element forming arrangement includes a Hall element that is formed in a principal surface of the semiconductor substrate. A base is formed separately from the semiconductor substrate. Then, the base is disposed at a rear surface of the semiconductor substrate and holds the semiconductor substrate and the Hall element forming arrangements. The base includes a holding surface, which holds the semiconductor substrate, and two slant surfaces, each of which is slanted relative to the holding surface. Each Hall element forming arrangement is held on a corresponding one of the at least one slant surface of the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.