Topology modeler
US7222057B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 31, 2002 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | Dec 17, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T17/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
According to one embodiment of the invention, a method for modeling a feature associated with a deformed material is provided. The method includes generating a first mesh having a model of a feature and a second mesh. A normal distance between a point on the model of the feature and the surface of the first mesh is measured. A location of the surface point of the first mesh that is used to measure the normal distance is determined. The determined location is used to locate the same surface point on the second mesh. A new location for a new point corresponding to the point on the model of the feature associated with the first mesh is determined. The new location is located at the distance as the determined normal distance, but along a normal vector that intersects the same surface point on the second mesh.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.