Package for electro-mechanical systems
US7222532B2 · kind B2 · utility
2Cited by
5References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 6, 2005 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Oct 6, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01C19/5691
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A packaging system in one example comprises an improved mechanical packaging system for a circuit board disposed between housing elements, the improvement comprising an upper housing member having a centrally disposed opening provided therethrough, a unitary electromagnetic shield disposed on at least an upper surface of the circuit board and secured to the circuit board, the unitary electromagnetic shield secured to the upper housing member, such that undesired mechanical vibration modes are substantially reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.