Solder-free packaging for integrated fiber optics device
US7223026B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2005 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Nov 3, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4239
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Techniques for packaging in an optical device and an opto-electrical conversion device are disclosed. According to one aspect of the techniques, the optical device is packaged in a piece of tubing and the opto-electrical conversion device is packaged in a TO-can. While the optical device and the opto-electrical conversion device are coaxially aligned, the tube and the TO-can are integrated by a certain amount of epoxy that is later cured by a UV light or heat. As a result, an integrated optical device is formed and enjoys features of small footprint, better alignment, enhanced impact performance, lower cost in addition to easier manufacturing process and environmental-safe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.