Optical communications adapter module configured for use inside a XENPAK-sized module
US7223027B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2003 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | May 13, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3893
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical communications adapter module is provided which includes a casing of a XENPAK-sized module and an optical communications board assembly positioned within the casing. The module also includes a first optical connector coupled to a second optical connector by fiber optics capable of communicating data between the first optical connector and the second optical connector where the first optical connector is coupled to a data transmission connector of the optical communications board assembly and the second optical connector is positioned at a face plate of the casing. The module also includes a third optical connector coupled to a fourth optical connector through fiber optics capable of transmitting data where the third optical connector is coupled to a data reception connector of the optical communications board assembly and the fourth optical connector is positioned at the face plate of the casing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.