Semiconductor laser device and a method of mounting a semiconductor laser component on a submount
US7223617B2 · kind B2 · utility
5Cited by
8References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2003 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Feb 8, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83192
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of mounting a semiconductor laser component capable of preventing deterioration of laser characteristics and destruction of the semiconductor laser component due to a rise in temperature and a residual stress of the semiconductor laser component. The semiconductor laser component is mounted on a submount by heating and pressure-bonding, and is heated again up to a temperature more than a melting point of a bonding member at the released pressure to release the residual stress.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.